Advances in LED Die Architectures
Thursday, March 02, 2017: 11:45 AM - 12:15 PM
Chip Scale Packaging for LEDs was first introduced in 2013 and since then it has been gaining market share in specific applications in particular market segments. In this paper we will review the compare and contrast the attributes of the current range of LED die architectures (CSP, ECVTF, VTF, TFFC, and Lateral) against the requirements in major segments to define what makes a particular architecture most suitable. Moreover, we will present the roadmaps for the leading architectures in terms of the same attributes to predict changes in the LED architecture adoption.